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High-Purity Copper Sulfate Pentahydrate (CuSO₄·5H₂O) with 25.0%-25.6% Copper Content and ≥99% Purity for Agriculture and Electroplating
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High-Purity Copper Sulfate Pentahydrate (CuSO₄·5H₂O) with 25.0%-25.6% Copper Content and ≥99% Purity for Agriculture and Electroplating
| MOQ: | 10Tons |
| Price: | Please contact customer service |
| Standard Packaging: | Bagged |
| Delivery Period: | About six weeks |
| Payment Method: | T/T |
| Supply Capacity: | 100,000 tons per year |
Detail Information
Place of Origin
China
Brand Name
SiChun HongJian
Model Number
Copper Sulfate
Chemical Formula:
CuSO₄·5H₂O
Highlight:
high-purity copper sulfate for agriculture
,copper sulfate CuSO₄ for electroplating
,chemical filler copper sulfate pentahydrate
Product Description
High-Purity Copper Sulfate CuSO₄·5H₂O for Agriculture and Electroplating
High-Purity Copper Sulfate Pentahydrate (CuSO₄·5H₂O)
Product Overview
High-Purity Copper Sulfate from Hongjian Chemical serves as a vital multi-functional raw material for agriculture and electroplating industries. With its well-defined crystalline structure, controlled copper content, and minimal impurities, it ensures superior performance in both crop nutrition and metal finishing applications. Our product undergoes strict quality control to meet the specific requirements of each sector.
Key Specifications
- Copper (Cu) Content: 25.0% - 25.4% (Agriculture), 25.4% - 25.6% (Electroplating)
- Purity: ≥99% (Agriculture), ≥99.5% (Electroplating Grade)
- Appearance: Uniform blue crystals, free from lumps and foreign matter
- Solubility: Fully soluble in water, leaving negligible residue
Application-Specific Solutions
1. Agriculture - "Reliable Crop Nutrition and Protection"
- Micronutrient Fertilizer: Corrects copper deficiency in soils, promoting healthy growth in cereals, fruits, and vegetables.
- Fungicide and Bactericide: Key component in Bordeaux mixture and other formulations to control fungal diseases like downy mildew, blight, and leaf spots.
- Seed Treatment: Used as a seed disinfectant to prevent seed-borne diseases.
2. Electroplating - "High-Performance Copper Deposition"
- Acid Copper Plating Baths: The primary source of copper ions in sulfate-based electroplating electrolytes for decorative and functional coatings.
- Printed Circuit Board (PCB) Manufacturing: Essential for through-hole plating (PTH) and pattern plating, ensuring excellent conductivity and throwing power.
- Electroforming and Master Alloy Plating: Provides consistent, high-purity copper ions for precise metal deposition.
Key Advantages for Each Sector
For Agriculture:
- High Bioavailability: Copper is readily available for plant uptake.
- Consistent Quality: Guaranteed copper content ensures accurate application rates.
- Low Heavy Metals: Minimized levels of contaminants like lead, cadmium, and arsenic for safer use on crops.
For Electroplating:
- Exceptional Purity: Low impurity levels (e.g., Chloride ≤ 10 ppm, Iron ≤ 5 ppm for high-grade) prevent bath contamination and defects.
- Bright, Smooth Deposits: Contributes to uniform, ductile, and pore-free copper layers.
- Enhanced Bath Stability: Reduces the need for frequent purification and extends bath life.
Quality Assurance
- Production: Sourced from high-purity copper and processed under controlled conditions.
- Analysis: Each batch is certified for Cu content, heavy metals, and insolubles.
- Packaging: 25 kg bags, 1000 kg super sacks, or customized packaging; stored dry to prevent caking.
Why Choose Our Copper Sulfate?
- Sector-Specific Grades: Tailored products for agriculture and electroplating with optimized properties.
- Technical Support: Assistance with application rates, tank makeup, and troubleshooting.
- Reliable Supply: Consistent quality and on-time delivery from a trusted manufacturer.
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