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High Purity Electronic Grade Sodium Persulfate (99% Min) - PCB Etchant & Microetching Agent for Circuit Board Manufacturing
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High Purity Electronic Grade Sodium Persulfate (99% Min) - PCB Etchant & Microetching Agent for Circuit Board Manufacturing
| MOQ: | 10 tấn |
| Giá: | Please contact customer service |
| Bao bì tiêu chuẩn: | Túi đóng gói và tấn |
| Thời gian giao hàng: | Khoảng sáu tuần |
| Phương thức thanh toán: | L/C,D/A,D/P,T/T,Western Union,MoneyGram |
| Năng lực cung cấp: | 100.000 tấn mỗi năm |
Thông tin chi tiết
Nguồn gốc
Trung Quốc
Hàng hiệu
SiChun HongJian
Số mô hình
Natri Persulfate
Tài liệu
Công thức hóa học:
Na2S2O8
Số đăng nhập CAS:
7775-27-1
Số đăng nhập EINECS:
231-892-1
Tỉ trọng:
2,4 g/cm³
Vẻ bề ngoài:
Bột tinh thể trắng
Mô tả bảo mật:
S17；S26；S36/37/39；S45
Mô tả mối nguy hiểm:
R8；R22；R36/37/38；R42/43
Làm nổi bật:
High Purity Sodium Persulfate
,Electronic Grade Na₂S₂O₈
,Microetching Agent PCB Etchant
Mô tả sản phẩm
Product Overview
High Purity Electronic Grade Sodium Persulfate (SPS) is a premium, high-performance oxidizing agent manufactured to meet the exacting standards of the printed circuit board (PCB) and electronics manufacturing industries. With a guaranteed minimum purity of 99% and stringent control over trace metals, chlorides, and other ionic contaminants, this white crystalline powder delivers consistent, reliable etching performance essential for producing high-density interconnect (HDI) boards, multi-layer laminates, and fine-line circuit patterns.
Key Features & Benefits
- High Purity (99% Min): Rigorous purification and quality control minimize impurities that can compromise circuit integrity, preventing ionic migration, surface contamination, and defects.
- Precision Etching Capability: Excellent bath stability and predictable etch rates allow for precise control over copper removal, critical for fine-line circuits with tight tolerances.
- Clean, Chloride-Free Chemistry: Chlorine-free formula decomposes into sodium sulfate and oxygen, leaving no corrosive residues and supporting environmentally responsible manufacturing.
- Versatile Microetching Performance: Creates controlled, roughened copper surfaces that dramatically improve adhesion of photoresists, solder masks, and electroless copper deposits.
- Enhanced Bath Stability: Superior thermal stability and slower decomposition rates translate to longer bath life, reduced chemical consumption, and lower operational costs.
Technical Specifications
| Chemical Name | Sodium Peroxodisulfate / Sodium Persulfate |
| CAS Number | 7775-27-1 |
| Molecular Formula | Na₂S₂O₈ |
| Purity | ≥ 99.0% |
| Appearance | White crystalline powder |
| Active Oxygen | ≥ 6.6% |
| pH (1% Solution) | 4.0 - 6.0 |
| Chlorides (Cl) | ≤ 0.005% (50 ppm) |
| Iron (Fe) | ≤ 5 ppm |
| Heavy Metals (as Pb) | ≤ 10 ppm |
| Manganese (Mn) | ≤ 1 ppm |
| Residue on Ignition | ≤ 0.05% |
| Insoluble Matter | ≤ 0.01% |
| Moisture | ≤ 0.10% |
Applications
PCB Inner Layer Etching
Selectively etches away unwanted copper after photoresist development, producing sharp, well-defined circuit traces with minimal undercut for HDI, IC substrates, and advanced packaging applications.
Microetching for Surface Preparation
Removes surface oxides and creates uniform, matte finish with controlled surface roughness, significantly enhancing adhesion strength for photoresists, solder masks, and copper deposits.
Desmear & Etchback Enhancement
Removes epoxy smear from drilled hole walls in multi-layer boards, ensuring reliable electrical connection between layers for aerospace, automotive, and medical electronics.
Photoresist Stripping Enhancement
Assists in breakdown and removal of cross-linked photoresist residues following etching operations, improving cleanliness and reducing need for aggressive mechanical brushing.
Semiconductor Lead Frame Cleaning
Cleans and microetches copper or silver-plated lead frames prior to wire bonding and die attachment, ensuring optimal bond strength and package reliability.
Usage Guidelines
For etching applications, sodium persulfate is typically prepared as a 15-25% (w/v) aqueous solution using deionized or distilled water. Optimal operating temperature ranges from 40-55°C (104-131°F).
| Concentration | 150-250 g/L |
| Temperature | 40-55°C |
| Etch Rate (Copper) | 0.5-2.0 µm/min |
| Copper Loading Capacity | Up to 30-40 g/L |
| pH | 4.0-6.0 |
| Bath Life | 7-14 days (depending on throughput) |
Process Control Recommendations
- Regular Analysis: Monitor persulfate concentration and copper content using titration, specific gravity measurements, or automated process control systems.
- Temperature Control: Maintain consistent bath temperature to ensure uniform etch rates across the entire panel surface.
- Agitation: Use spray etching systems or forced circulation to promote uniform etching and prevent localized depletion.
- Replenishment: Implement controlled replenishment system based on copper loading and throughput to extend bath life.
Safety & Handling
As a strong oxidizing agent, sodium persulfate requires strict adherence to safety protocols:
- Personal Protective Equipment (PPE): Wear chemical-resistant gloves, safety goggles, protective clothing, and NIOSH-approved dust masks.
- Ventilation: Handle in well-ventilated areas with local exhaust ventilation when mixing dry powder.
- Storage: Store in cool, dry environment below 30°C (86°F), away from direct sunlight, heat sources, and incompatible materials.
- Incompatible Materials: Avoid contact with strong reducing agents, alkalis, combustible materials, organic compounds, and finely divided metals.
Packaging & Logistics
Packaged under controlled conditions in:
- 25 kg Fiber Drums with polyethylene liners
- 25 kg Multi-layer Kraft Paper Bags with moisture barrier
- 25 kg Rigid Cartons with inner liners
- Custom packaging (500 kg, 1000 kg bulk bags, or IBC totes) available upon request
All packaging includes complete labeling and each shipment is accompanied by a Certificate of Analysis (CoA) providing detailed quality specifications and full traceability.
Environmental Considerations
Sodium persulfate solutions decompose into sodium sulfate and oxygen—both environmentally benign compounds. Unlike chlorine-based etchants, spent baths do not contain hazardous heavy metals or toxic chlorinated compounds, significantly simplifying waste treatment and reducing environmental compliance costs.
Quality Assurance
Each batch undergoes comprehensive testing including:
- ICP-MS analysis for trace metal impurities
- Ion chromatography for anion impurities
- Titration for active oxygen content and purity
- Particle size analysis for consistent dissolution characteristics
- Microbiological testing where specified
Conclusion
For PCB manufacturers and electronics fabricators seeking a reliable, high-purity etching and microetching solution, High Purity Electronic Grade Sodium Persulfate (99% Min) delivers the performance, consistency, and cleanliness required for today's advanced circuit board production. Its chloride-free chemistry, excellent bath stability, superior adhesion promotion capabilities, and ultra-low impurity profile make it the ideal choice for inner layer etching, surface preparation, fine-line fabrication, and semiconductor packaging applications.
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