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High Purity 99.99% Electronic Grade Ammonium Persulfate (APS) for PCB Etching and Semiconductor Manufacturing
| Moq: | 10 ton |
| Prijs: | Please contact customer service |
| Standaardverpakking: | Zakken en tonzakken |
| Leveringsperiode: | Ongeveer zes weken |
| Betaalmethode: | L/C, D/A, D/P, T/T, Western Union, MoneyGram |
| Leveringscapaciteit: | 100.000 ton per jaar |
99.99% Purity Ammonium Persulfate
,PCB Etchant APS
,Semiconductor Manufacturing (NH4)2S2O8
Premium ultra-high-purity oxidizing agent engineered for modern electronics manufacturing with guaranteed minimum purity of 99.99%. Meticulously refined to eliminate trace metals, halides, and particulate contaminants that compromise semiconductor device and PCB performance.
- Ultra-High Purity (99.99% Min): Strictly controlled impurity limits for transition metals and halides eliminate ionic contamination, dendrite growth, and surface defects
- Precision Etching Capability: Linear, predictable etch rates maintain tight tolerances for high-density interconnect boards and semiconductor packaging
- Clean Oxidizing Action: Decomposes into innocuous byproducts without corrosive chloride residues, supporting greener manufacturing processes
- Superior Surface Activation: Creates uniform microscopically roughened surfaces to improve adhesion of photoresists, solder masks, and metal deposition layers
| Chemical Name | Ammonium Peroxodisulfate / Ammonium Persulfate |
| CAS Number | 7727-54-0 |
| Molecular Formula | (NH₄)₂S₂O₈ |
| Purity | ≥ 99.99% |
| Appearance | White crystalline powder |
| Active Oxygen | ≥ 6.9% |
| pH (1% Solution) | 3.0 - 5.0 |
| Chlorides (Cl) | ≤ 5 ppm |
| Iron (Fe) | ≤ 1 ppm |
| Heavy Metals (as Pb) | ≤ 2 ppm |
| Residue on Ignition | ≤ 0.02% |
Preferred etchant for inner layer imaging in double-sided and multi-layer PCBs. Selectively removes unwanted copper with high solubility and clean reaction, achieving fine-line geometries down to 2 mil lines and spaces.
Utilized in wafer fabrication and advanced packaging for:
- Front-End of Line (FEOL): Surface cleaning and oxidation of silicon substrates
- Back-End of Line (BEOL): Micro-etching of copper damascene structures and polymer residue removal
- Lead Frame Cleaning: Oxide removal from copper or silver-plated lead frames for reliable bonding
Effective at oxidizing and solubilizing hardened photoresist residues. Creates mechanically interlocking surface profiles for enhanced metal-to-metal adhesion in ENIG and electroless copper deposition processes.
Solution Preparation: Prepare as 15-25% (w/v) aqueous solution heated to 40-50°C (104-122°F) for optimal etch rates of 0.5-1.5 µm per minute.
- Etch Rate Monitoring: Maintain copper content below 30 g/L with regular specific gravity analysis
- Temperature Control: Use thermostatically controlled bath; avoid temperatures above 60°C
- Agitation: Implement spray etching or forced circulation for uniform etching
Stabilization: Working solutions should be replenished or replaced based on throughput. Fresh batch processing recommended for highest purity applications.
As a strong oxidizer, strict adherence to safety protocols is required:
- Personal Protective Equipment (PPE): Chemical-resistant gloves, safety goggles, protective aprons, and NIOSH-approved respirators for dust areas
- Ventilation: Use in well-ventilated areas or under local exhaust ventilation
- Storage: Store in cool, dry environment below 30°C (86°F) away from reducing agents, alkalis, and combustible materials
- Incompatibility: Avoid contact with strong reducing agents, finely divided metals, and organic compounds
- First Aid: For skin contact, wash thoroughly with soap and water. For eye contact, rinse with water for 15 minutes and seek medical attention
Packaged under clean conditions to preserve ultra-high purity:
- 25 kg Fiber Drums with polyethylene liners
- 25 kg Multi-layer Kraft Paper Bags with moisture barrier
- Custom packaging available upon request
All containers include clear labeling with lot numbers, manufacturing dates, and full traceability documentation including Certificate of Analysis (CoA) for each batch.
High Purity Electronic Grade Ammonium Persulfate (99.99% Min) delivers the purity, consistency, and performance required to meet exacting industry standards for semiconductor manufacturing and PCB fabrication. Ensures precise etch rates, flawless surface finishes, and reliable performance for high-reliability electronic components.
