các sản phẩm
Chi tiết sản phẩm
Nhà > các sản phẩm >
High Purity 99.99% Electronic Grade Ammonium Persulfate (APS) for PCB Etching and Semiconductor Manufacturing

High Purity 99.99% Electronic Grade Ammonium Persulfate (APS) for PCB Etching and Semiconductor Manufacturing

MOQ: 10 tấn
Giá: Please contact customer service
Bao bì tiêu chuẩn: Túi đóng gói và tấn
Thời gian giao hàng: Khoảng sáu tuần
Phương thức thanh toán: L/C,D/A,D/P,T/T,Western Union,MoneyGram
Năng lực cung cấp: 100.000 tấn mỗi năm
Thông tin chi tiết
Nguồn gốc
Trung Quốc
Hàng hiệu
SiChun HongJian
Số mô hình
Ammonium Persulfate
Tài liệu
Công thức hóa học:
(NH4) 2S2O8
Số đăng nhập CAS:
7727-54-0
Số đăng nhập EINECS:
231-786-5
Tỉ trọng:
1,98 g/cm³
Vẻ bề ngoài:
Bột tinh thể trắng
Mô tả bảo mật:
S22;S24;S26;S37
Mô tả mối nguy hiểm:
R8;R22;R36/37/38;R42/43
Trọng lượng phân tử:
228.201
Làm nổi bật:

99.99% Purity Ammonium Persulfate

,

PCB Etchant APS

,

Semiconductor Manufacturing (NH4)2S2O8

Mô tả sản phẩm
High Purity Electronic Grade Ammonium Persulfate

Premium ultra-high-purity oxidizing agent engineered for modern electronics manufacturing with guaranteed minimum purity of 99.99%. Meticulously refined to eliminate trace metals, halides, and particulate contaminants that compromise semiconductor device and PCB performance.

Key Features & Benefits
  • Ultra-High Purity (99.99% Min): Strictly controlled impurity limits for transition metals and halides eliminate ionic contamination, dendrite growth, and surface defects
  • Precision Etching Capability: Linear, predictable etch rates maintain tight tolerances for high-density interconnect boards and semiconductor packaging
  • Clean Oxidizing Action: Decomposes into innocuous byproducts without corrosive chloride residues, supporting greener manufacturing processes
  • Superior Surface Activation: Creates uniform microscopically roughened surfaces to improve adhesion of photoresists, solder masks, and metal deposition layers
Technical Specifications
Chemical Name Ammonium Peroxodisulfate / Ammonium Persulfate
CAS Number 7727-54-0
Molecular Formula (NH₄)₂S₂O₈
Purity ≥ 99.99%
Appearance White crystalline powder
Active Oxygen ≥ 6.9%
pH (1% Solution) 3.0 - 5.0
Chlorides (Cl) ≤ 5 ppm
Iron (Fe) ≤ 1 ppm
Heavy Metals (as Pb) ≤ 2 ppm
Residue on Ignition ≤ 0.02%
Applications
PCB Etching (Inner & Outer Layers)

Preferred etchant for inner layer imaging in double-sided and multi-layer PCBs. Selectively removes unwanted copper with high solubility and clean reaction, achieving fine-line geometries down to 2 mil lines and spaces.

Semiconductor Manufacturing

Utilized in wafer fabrication and advanced packaging for:

  • Front-End of Line (FEOL): Surface cleaning and oxidation of silicon substrates
  • Back-End of Line (BEOL): Micro-etching of copper damascene structures and polymer residue removal
  • Lead Frame Cleaning: Oxide removal from copper or silver-plated lead frames for reliable bonding
Photoresist Stripping & Surface Preparation

Effective at oxidizing and solubilizing hardened photoresist residues. Creates mechanically interlocking surface profiles for enhanced metal-to-metal adhesion in ENIG and electroless copper deposition processes.

Usage Guidelines

Solution Preparation: Prepare as 15-25% (w/v) aqueous solution heated to 40-50°C (104-122°F) for optimal etch rates of 0.5-1.5 µm per minute.

Process Control
  • Etch Rate Monitoring: Maintain copper content below 30 g/L with regular specific gravity analysis
  • Temperature Control: Use thermostatically controlled bath; avoid temperatures above 60°C
  • Agitation: Implement spray etching or forced circulation for uniform etching

Stabilization: Working solutions should be replenished or replaced based on throughput. Fresh batch processing recommended for highest purity applications.

Safety & Handling

As a strong oxidizer, strict adherence to safety protocols is required:

  • Personal Protective Equipment (PPE): Chemical-resistant gloves, safety goggles, protective aprons, and NIOSH-approved respirators for dust areas
  • Ventilation: Use in well-ventilated areas or under local exhaust ventilation
  • Storage: Store in cool, dry environment below 30°C (86°F) away from reducing agents, alkalis, and combustible materials
  • Incompatibility: Avoid contact with strong reducing agents, finely divided metals, and organic compounds
  • First Aid: For skin contact, wash thoroughly with soap and water. For eye contact, rinse with water for 15 minutes and seek medical attention
Packaging & Logistics

Packaged under clean conditions to preserve ultra-high purity:

  • 25 kg Fiber Drums with polyethylene liners
  • 25 kg Multi-layer Kraft Paper Bags with moisture barrier
  • Custom packaging available upon request

All containers include clear labeling with lot numbers, manufacturing dates, and full traceability documentation including Certificate of Analysis (CoA) for each batch.

Conclusion

High Purity Electronic Grade Ammonium Persulfate (99.99% Min) delivers the purity, consistency, and performance required to meet exacting industry standards for semiconductor manufacturing and PCB fabrication. Ensures precise etch rates, flawless surface finishes, and reliable performance for high-reliability electronic components.

Sơ đồ trang web |  Chính sách bảo mật | Trung Quốc Chất lượng tốt Các persulfate Nhà cung cấp. 2025-2026 Sichuan Hongjian Xinyi Technology Co., Ltd. Tất cả các quyền được bảo lưu.